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Describe APCVD process with neat diagram. Why wafers are lying horizontal in this process? Enlist drawbacks of this process.
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teamques10
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The important distinctions between the different CVD techniques are the amount of pressure required in the reaction chamber and the energy source.
An atmospheric pressure chemical vapor deposition (APCVD) system uses atmospheric pressure or 1 atm in the reaction chamber.
A “cold Wall reactor” is used in this process. Only …
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