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MEMS Technology - Dec 18
Electronics Engineering (Semester 8)
Total marks: 80
Total time: 3 Hours
INSTRUCTIONS
(1) Question 1 is compulsory.
(2) Attempt any three from the remaining questions.
(3) Draw neat diagrams wherever necessary.
1.a.
What is MEMS? Give two examples of MEMS devices which are characterized by sensors and actuators.
(5 marks)
11835
1.b
What are polymers? Discuss its role in MEMS fabrication.
(5 marks)
11836
1.c
Explain the steps in standard RCA cycle, during wafer cleaning.
(5 marks)
11837
1.d
Explain packaging challenges in MEMS devices.
(5 marks)
11838
2.a
What are different silicon compounds. Explain their characteristics and uses in MEMS device fabrication.
(10 marks)
11803
2.b
State various physical vapor deposition techniques. Explain in brief any one technique of PVD in MEMS fabrication.
(10 marks)
11780
3.a
Explain the process of photolithography in detail.
(10 marks)
11839
3.b
Distinguish between Wet and Dry etching process with suitable applications.
(10 marks)
11826
4.a
Describe the representative process flow for fabricating the cantilever structure.
(10 marks)
11829
4.b
Define reliability in MEMS devices. Explain it using bath-tub-curve.
(10 marks)
11799
5.a
Explain in detail, fabrication steps for MEMS microheater.
(10 marks)
11815
5.b
Differentiate between surface and bulk micromachining with suitable examples.
(10 marks)
11800
6 Write short note on:
6.a
MEMS sensors in IOT applications.
(5 marks)
11793
6.b
Selection of MEMS material based on applications
(5 marks)
11840
6.c
Wafer bonding techniques.
(5 marks)
11785
6.d
MEMS device characteristics.
(5 marks)
11841
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