Write short note on Wire Bonding techniques

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written 8.2 years ago by

hetalgosavi • 1.6k

modified 5.6 years ago by

ankitpandey • 100

Mumbai University > Electronics Engineering > Sem 8 > MEMS Technology

Marks: 5M

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written 8.2 years ago by

hetalgosavi • 1.6k

Wire bonding is the oldest method for connecting a chip or die to the inner leadframe of the package.
Gold wires with 25 to 50 μm diameter or aluminum wires with 25 μm diameter are commonly used.
The bonding of the wires occurs by application of heat and ultrasonic energy …

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