MEMS technology is the batch fabrication aspect—hundreds and thousands of identical structures or microsystems are fabricated simultaneously on the same wafer.
Dicing separates these structures into individual components (dice) that can be later packaged.
A diamond or carbide saw blade, approximately 50 to 250 μm wide, spins at high speed and cuts through the substrate that is normally mounted and held in position on a colored “sticky tape” known as dicing tape.
Water flows continuously during sawing to cool the blade. Dicing is a harsh process conducted in an unclean environment and subjects the microstructures to strong vibrations and flying debris.
Retaining the integrity and cleanliness of the microstructures requires protecting the sensitive components from particulates and liquids as well as ensuring that they can survive all of the shaking.