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Compare wet etching and Dry etching

written 9.4 years ago by manish090801 • 0

modified 6.5 years ago by samuelmorish • 0

mems technology

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written 9.4 years ago by manish090801 • 0

modified 6.7 years ago by tusharghangas1 • 0

Parameters	Dry Etching	Wet etching
Directionality	Good for most materials	Only with crystal materials [Aspect ratio upto 100]
Production automation	Good	Poor
Environmental impact	Low	High
Masking film adherence	Not as critical	Very critical
Selectivity	Poor	Very Good
Materials to be etched	Only certain materials	All
Process scale-up	Difficult	Easy
Cleanliness	Conditionally clean	Good to very good
Equipment cost	Expensive	Less expensive
Operational parameters	Many	Few
Typical etch rate	Slow [$0.1 \mu m/min$] to fast [$6 \mu m/min$]	Fast [$1 \mu m/min \ and \ up$]
Control of etch rate	Good in case of slow etch	Difficult
Application:For making very small features in thin films	Possible to etch almost straight down without under cutting	Undercutting problem will occur

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