Mumbai University > Electronics Engineering > Sem 8 > MEMS Technology

Marks: 2M

• Bulk micromanufacturing technique involves creating 3-D components by removing materials from thick substrates (silicon or other materials) using primarily etching method.
• Etching – dry or wet etching is the principal technique used in bulk micromanufacturing.

• Substratesthat can be etched in bulk micromanufacturing include:-

  1) Silicon 2) SiC 3) GaAs 4) Special polymers

• Wet etching involves the use of chemical solvents (called etchants
• Dry etching uses plasma to remove materials at the desired locations on a substrate.