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Anisotropic etching of silicon

Mumbai University > Electronics Engineering > Sem 8 > MEMS Technology

Marks: 3M

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  • Anisotropic etching is easier to control of the etched shape of the substrates.
  • Disadvantages:

  • Slower in rate of etching (< 1 µm/minute)

  • The rate is temperature – sensitive.
  • Best performance at elevated temperature eg. 1000 C.

    Temperature resistive mask materials.

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