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Failure Mechanism in MEMS and Microsystems
written 6.9 years ago by | modified 13 months ago by |
Mumbai University > Electronics Engineering > Sem 8 > MEMS Technology
Marks: 3M
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written 6.9 years ago by | modified 13 months ago by |
Mumbai University > Electronics Engineering > Sem 8 > MEMS Technology
Marks: 3M
written 6.9 years ago by |
Failure Mode | Causes | Probability |
---|---|---|
Mechanical | Local stress concentration due to surface roughness. | Low |
Improper assembly tolerances | Moderate | |
Vibration – induced high cycles fatigue failure | Low in silicon, moderate in plastic | |
Delamination of thin layers | Moderate to high | |
Thermal stresses by mismatch of CTE | High | |
Electromechanical break-down | Collapse of electrodes due to excessive deformation | High |
Deterioration of materials | Aging and degassing of plastics and polymers. Corrosion and erosion of materials. | Moderate |
Excessive intrinsic stresses | Residual stresses and molecular forces inherent from microfabrication. | High |
Packaging | Improper bonding and sealing, poor die protection and isolation. | High |
Environmental effects | Temperature, humidity, dusts and toxic gas | High |