Failure Mechanism in MEMS and Microsystems

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Failure Mode	Causes	Probability
Mechanical	Local stress concentration due to surface roughness.	Low
	Improper assembly tolerances	Moderate
	Vibration – induced high cycles fatigue failure	Low in silicon, moderate in plastic
	Delamination of thin layers	Moderate to high
	Thermal stresses by mismatch of CTE	High
Electromechanical break-down	Collapse of electrodes due to excessive deformation	High
Deterioration of materials	Aging and degassing of plastics and polymers. Corrosion and erosion of materials.	Moderate
Excessive intrinsic stresses	Residual stresses and molecular forces inherent from microfabrication.	High
Packaging	Improper bonding and sealing, poor die protection and isolation.	High
Environmental effects	Temperature, humidity, dusts and toxic gas	High

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