Ask
Login
0
2.3kviews
Silicon Fusion Bonding [Direct Wafer Bonding]
written 6.9 years ago by gravatar for hetalgosavi hetalgosavi • 1.6k modified 6.9 years ago by gravatar for awari.swati831 awari.swati831 • 100

Mumbai University > Electronics Engineering > Sem 8 > MEMS Technology

Marks: 5M
mems technology
ADD COMMENT EDIT
1 Answer
0
37views
written 6.9 years ago by gravatar for hetalgosavi hetalgosavi • 1.6k

The direct bonding of silicon wafers to one another requires high temp, on the order of 10000 C

enter image description here

The first step is the cleaning and hydration of the surfaces, they must be smooth and completely particle free. Because contaminant particles create gaps which causes the bonding to fail.

Hydration typically …

Create a free account to keep reading this post.

and 3 others joined a min ago.

ADD COMMENT EDIT
Please log in to add an answer.