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Explain ROM Array
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The read-only memory array can also be seen as a simple combinational Boolean network which produces a specified output value for each input combination,i.e., for each address. Thus, storing binary information at a particular address location can be achieved by the presence or absence of a data path from the selected row (word line) to the selected column (bit line), which is equivalent to the presence or absence of a device at that particular location. In the following, we will examine two different implementations for MOS ROM arrays. Consider first the 4-bit x4-bit memory array shown in Fig. Here, each column consists of a pseudo-nMOS NOR gate driven by some of the row signals, i.e., the word lines.

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As described in the previous section, only one word line is activated (selected) at a time by raising its voltage to VDD, while all other rows are held at a low voltage level. If an active transistor exists at the cross point of a column and the selected row, the column voltage is pulled down to the logic low level by that transistor. If no active transistor exists at the cross point, the column voltage is pulled high by the pMOS load device. Thus, a logic " 1 "-bit is stored as the absence of an active transistor, while a logic ""-bit is stored as the presence of an active transistor at the crosspoint. To reduce static power consumption, the pMOS load transistors in the ROM array shown in Fig can also be driven by a periodic precharge signal, resulting in a dynamic ROM.

In actual ROM layout, the array can be initially manufactured with nMOS transistors at every row-column intersection. The " 1 "-bits are then realized by omitting the drain or source connection, or the gate electrode of the corresponding nMOS transistors in the final metallization step. Figure shows four nMOS transistors in a NOR ROM array, forming the intersection of two metal bit lines and two polysilicon word lines. To save silicon area, the transistors in every two adjacent rows are arranged to share a common ground line, also routed in n-type diffusion. To store a 0-bit at a particular address location, the drain diffusion of the corresponding transistor must be connected to the metal bit line via a metal-to-diffusion contact. Omission of this contact, on the other hand, results in a stored "1 "-bit.

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Figure shows a larger portion of the ROM array, except for the pMOS load transistors connected to the metal columns. Here, the 4-bit x 4-bit ROM array shown in Fig is realized using the contact-mask programming methodology described above. Note that only 8 of the 16 nMOS transistors fabricated in this structure are actually connected to the bit lines via metal-to-diffusion contacts. In reality, the metal column lines are laid out directly on top of diffusion columns to reduce the horizontal dimension of the ROM array.

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A different NOR ROM layout implementation is based on deactivation of the nMOS transistors by raising their threshold voltages through channel implants. Figure shows the circuit diagram of a NOR ROM array in which every two rows of nMOS transistors share a common ground connection, and every drain diffusion contact to the metal bit line is shared by two adjacent transistors. In this case, all nMOS transistors are already connected to the column lines (bit lines); therefore, storing a " 1 "-bit at a particular location by omitting the corresponding drain contact is not possible. Instead, the nMOS transistor corresponding to the stored " 1 "-bit can be deactivated, i.e., permanently turned off, by raising its threshold voltage above the VOH level through a selective channel implant during fabrication.

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Here, each bit line consists of a depletion-load NAND gate, driven by some of the row signals, i.e., the word lines. In normal operation, all word lines are held at the logic-high voltage level except for the selected line, which is pulled down to logic-low level. If a transistor exists at the crosspoint of a column and the selected row, that transistor is turned off and the column voltage is pulled high by the load device.

On the other hand, if no transistor exists (shorted) at that particular crosspoint, the column voltage is pulled low by the other nMOS transistors in the multi-input NAND structure. Thus, a logic "1 "-bit is stored by the presence of a transistor that can be deactivated, while a logic "0"-bit is stored by a shorted or normally on transistor at the crosspoint.

As in the NOR ROM case, the NAND-based ROM array can be fabricated initially with a transistor connection present at every row-column intersection. A "0"-bit is then stored by lowering the threshold voltage of the corresponding nMOS transistor at the cross point through a channel implant, so that the transistor remains on regardless of the gate voltage (i.e., the nMOS transistor at the intersection becomes a depletion-type device). The availability of this process step is also the reason why depletion-type nMOS load transistors are used instead of pMOS loads in the example shown above.

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Figure shows a sample 4-bit x 4-bit layout of the implant-mask NAND ROM array. Here, vertical columns of n-type diffusion intersect at regular intervals with horizontal rows of polysilicon, which results in an nMOS transistor at each intersection point. The transistors with threshold voltage implants operate as normally-on depletion devices, thereby providing a continuous current path regardless of the gate voltage level. Since this structure has no contacts embedded in the array, it is much more compact than the NOR ROM array. However, the access time is usually slower than the NOR ROM, due to multiple series-connected nMOS transistors in each column. An alternative layout method for the NAND ROM array is not to place the nMOS transistors at "1"-bit locations, as in the case of the PLA (Programmable Logic Array) layout generation. In this case, the missing transistor is simply replaced by a metal line, instead of using a threshold voltage implant at that location.

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