Advantages :

• Less material loss

• Good dimensional control as it is not limited to low aspect ratio in geometry

• CMOS integration is good as devices are build up from the wafer layer by layer.

• Good mechanical property

Disadvantages :

• Higher fabrication steps involved and hence expensive.

• Complex technology involving process of repetitive deposition of thin films on wafer, photo patterning them and etching them.

• Difficult to implement for large structures