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MEMS device characteristics
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  • Following are the MEMS device characteristics which we have to consider while designing MEMS devices.

1) Piezoresistance

2) TCR

3) Stiffness

4) Adhesion

5) Vibration

6) Resonant frequency

1) Piezoresistance [PZR] : It is the change in the electrical resistivity of a solid induced by an applied mechanical stress. Its origin in bulk, crystalline materials like silicon, is principally a change in the electronics structure which leads to a modification of the charge carriers effective mass.

2) TCR : [Temperature coefficient of resistance] : It is one of the main used parameters to characterize a resistor. TCR defines the change in resistance as a function of the ambient temperature. The common way to express the TCRiS in ppm/°C

3) Stiffness : stiffness is defined as a paper boards resistance to bending caused by a given applied force.

4) Adhesions : The work of adhesions is defined to be the free energy change to separate unit areas of two surfaces from contact to infinity. Both in plane and sidewall adhesion occurs in MEMS actuators.

5) Vibration : Vibration is a mechanical phenomenon whereby oscillations occur about an equilibrium point. The oscillations may be periodic or random. The studies of sound and vibration are closely related. Sound or pressure waves are generated by vibrating structures.

6) Resonant frequency : A resonant frequency is a natural frequency of vibration determined by the physical parameters of the vibrating object. It is easy to get an object to vibrate at its resonant frequencies.

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